Mike Wood Articles
- Passive trends: IoT revolution drives miniaturization Sep 20, 2016 Given that passive components make up the greatest percentage of the physical space on the circuit board, it’s no surprise that miniaturization is the dominant trend in passive technologies. Increasingly, chip manufacturers require smaller package designs that deliver the same capacitance or resistance as their former larger versions. Passives manufacturers are complying with this demand by offering extended value ranges in smaller package designs. For example, buyers can now source multilayer ceramic capacitors (MLCC) with specs of 2.2uF capacitance and a 10 volts rating in the smaller 0201 package size versus the formerly common 0402 size.