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Weekly Global Update for June 28, 2017

6/28/2017 // Walt D. Custer in: Industry

June “Flash” PMI Leading Indicators; Japan Update; Smartphone Makers may see Component Shortages in 2H’17 resulting from Design-In of Larger Memory Capacity, High-Density Batteries, High-Resolution Cameras as well as Dual-Lens Camera Modules; German Robotics & Automation Sales Expected to Grow 7% Y/Y in 2017 after New High in 2016; Cellphone IC Sales Projected to Grow 16% y/y in 2017 to US$84.4 billion while Personal Computing Systems' IC Market will increase 9% y/y to US$80.1 billion; Worldwide 3D Printer Shipments increased 29% in 2016 while Revenue Grew by more than 18% Year over Year; Worldwide Top-5 Notebook Vendors Combined Shipments increased 26% m/m & Top-3 ODMs expanded 34% m/m in May; Win Semi Looks to 5G Base Station Construction for 2018 growth

Industry Outlook Calls for Moderate Growth

6/27/2017 // Victoria Kickham in: Industry

Manufacturing economy improves, but industry watchers say moderation is still the norm.

New Passive Component Design Kit for IoT Applications

6/22/2017 // Murray Slovick in: Passives

The Internet of Things is not only driving the electronic component market, but it’s also influencing the direction design/development kits are taking. While passives and connectors are changing to meet the new demands of IoT projects (for example many IoT nodes need capacitors for coupling, decoupling and filtering), manufacturers also are being asked to deliver smaller packages that deliver the same capacitance or resistance as their former larger versions along with excellent reliability and a high Mean Time To Failure (MTTF).