COM Express (Computer-on-Module) delivers the highest performance available on an extremely small embedded module. The advantage of this new standard is that it brings the benefits of standardization to the Computer-on-Module methodology, enabling developers to keep pace with advances in processor architecture and serial interface technology without the need to reengineer their products for each next generation of technology.
Description
The new TE Connectivity 0.5mm FH product is specified by the PICMG COM Express standard as the module to carrier card interface. 0.5mmFree Height (FH) is a two piece connector system designed for parallel board to board stacking applications