The LGA (Land Grid Array) sockets were developed for Intel and AMD based LGA microprocessor packages that range in size up to 1200+ positions. This generation of LGA sockets provide a compressive electrical interface to the microprocessor package and are solder ball SMT (Surface Mount) attach to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce risk of contact damage during handling and package installation.
TE Connectivity LGA Sockets
Features
- LGA compressive interface to package, surface mount solderball attach to PCB
- For Intel and AMD CPU PGA packages
- Stamped and formed metal contacts
- 1.1mm x 1.1mm and 1.17mm x 1.09mm contact spacing
- Socket arrays up to 1,200+ positions
Applications
- Desktop computers
- Workstations
- Server class computers