"MAGICSTRAP®" can be easily assembled by means of reflow soldering and adhesive (electrically conductive or non-conductive) . Even if non-conductive adhesive is used, communication will take place when "MAGICSTRAP®" is bonded onto the antenna, and the RFID tag will function correctly.
"MAGICSTRAP®" has a very unique function to utilize conductive materials as booster antenna, when MAGICSTRAP® is correctly mounted in accordance with the reference design. For example, "MAGICSTRAP®" can add passive RFID tag function on ground plane of PCB (print circuit board) .
Additionally, "MAGICSTRAP®" is an ultra-miniature (ex. 3.2 x 1.6 x 0.6mm) robust package with impedance transformation function implemented by RF circuit in its LTCC substrate. Thus, even if "MAGICSTRAP®" does not have any additional antenna, "MAGICSTRAP®" can also work as a very small complete RFID tag for contact sensing.