Designed for high-current density applications, Molex's EXTreme MicroPower header is soldered directly to PCBs such as a Voltage Regulator Module (VRM) or a mother-board using a slotted via. With a current rating of 16.0A per blade at 30° T-rise, Micro-Max Power may be used in any board-to-board application where power transfer is needed through a non-separable interface in a compact design. EXTreme MicroPower headers are available in circuit sizes ranging from 4-to-24 blades in a single-row configuration. Optional voided circuits are available to allow for use in high-voltage applications.
Molex EXTreme MicroPower High-Current Header
Features
- 4.17mm (.164) connector height off the PCB
- Low-profile design enhances system airflow
- Non-separable interface
- Allows for higher-current and greater density capability with lower resistance plane-to-plane compared to similar products with separable interfaces or standard stick headers
- Compact size
- Improves airflow and saves PCB space
- Optional voided circuits
- Design flexibility for high-voltage applications
- Two blade lengths available
- Accommodates 1.57 to 2.36mm (.050 to .093) PCB thickness
- Reliable and compact where change-out is not needed
- Easily adaptable to many applications
- Saves PCB space on small cards and tight mounting envelopes
Applications
- VRM modules or any application for point-of-load power transfer
- Small Form Factor (SFF)
- PCs
- workstations
- servers
- routers
- switches