Ideal for space-constrained designs with limited PCB real estate, the modular NeoScale mezzanine system provides a durable and easily customizable design tool for high-density system applications. Each NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, customers can mix and match components to build a mezzanine solution to meet their requirements for signals supporting high-speed differential pairs (85 and 100 ohm), high-speed single-ended transmissions, low-speed single-ended signals and power contacts.
Molex NeoScale High-Speed Mezzanine System
Features
• Modular triad wafer design with four triad configurations for high-speed differential pairs, single-ended and power requirements
• Housing design based on honeycomb construction
• High-speed triad wafers comprise three pins per differential pair
• Connectors feature 246 circuits with a density of 82 differential pairs per square inch
• Mirror-image triad layout enables the PCB routing in one or two layers for four- and six-row housings respectively
Applications
• Industrial
o Personality Cards
• Medical
o High data-rate scanning
• Network
o NAS Towers
o Rack-mount server
• Telecom
o Hubs
o Servers