Leading the datacom computing markets with high data-rate and high-density solutions, the Impel Backplane Interconnect System provides a scalable price-for-performance solution enabling customers to secure a high-speed 25 and 40 Gbps footprint.
Molex continues to lead development in the backplane and cable assembly market through innovative connector products. Customers are currently designing new high-end system architectures that will require data-rate improvements. The Impel Backplane Interconnect System provides the footprint and interface that will enable customers to migrate to faster data rates (40 Gbps), without completely re-designing their architecture or replacing hardware already placed in the data-center, while meeting the mechanical density requirements being driven by the industry.