The leading choice in today’s surface mount designs is the KEMET T491 Series. This product meets or exceeds the requirements of EIA standard 535BAAC. The physical outline and dimensions of this series conform to this global standard.
This product was designed specifically for today’s highly automated surface mount processes and equipment. This series uses the same proven solid tantalum KEMET technology acclaimed and respected throughout the world. Added to this is the latest in materials, processes and automation which result in a component unsurpassed worldwide in total performance and value.
The standard terminations are 100% matte tin and provide excellent wetting characteristics and compatibility with today’s surface mount solder systems. Tin-Lead (SnPb) terminations are available upon request for any part number. Gold-plated terminations are also available for use with conductive epoxy attachment processes. The symmetrical terminations offer total compliancy to provide the thermal and mechanical stress relief required in today’s technology. Lead frame attachments to the tantalum pellet are made via a microprocessor controlled welding operation, and a high temperature silver epoxy adhesive system. Standard packaging of these devices is tape and reel in accordance with EIA 481 This system provides perfect compatibility with all tape-fed placement units.
These components are RoHS compliant.