Reference Only

470-2155-600

Board to Board & Mezzanine Connectors 200P NeXLev Recept Solder Balls.

Manufacturer:

Mfr Part:
470-2155-600

TTI Part:
Not Assigned

EDA / CAD Models

Specifications

DescriptionProduct Attribute
Similar
ManufacturerAmphenol
Product CategoryBoard to Board & Mezzanine Connectors
ProductReceptacles
Number of Positions200 Position
Pitch1.15 mm (0.045 in)
Number of Rows20 Row
Termination StyleBGA
Mounting AngleVertical
Stack Height18 mm, 20 mm, 22 mm, 25 mm
Current Rating1 A
Voltage Rating600 V
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 105 C
Contact PlatingGold
Contact MaterialCopper Alloy
Housing MaterialLiquid Crystal Polymer (LCP)
SeriesNeXLev
PackagingTray
Moisture SensitiveYes
Product TypeBoard to Board & Mezzanine Connectors
SubcategoryBoard to Board & Mezzanine Connectors
TradenameNeXLev

Export and Environmental Classification

AttributeDescription
ECCNEAR99
HTS8536694040
TARIC8536693000
RoHS CompliantYes
RoHS Compliant
RoHS Exemption NumberN/A
Lead(PB) in TerminalsCall to Verify PB
REACH SVHCNo
REACH Substance NameN/A

Documents

EDA / CAD Models

0In Stock

Available For Backorder
Please adjust quantity to minimum and multiple values.
Quantity
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Unit Price
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Ext. Price
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Tray

(Minimum: 24 / Multiples: 24)
Quantity Unit PriceExt. Price
$45.84$1,100.16
$44.31$2,126.88
$41.88$5,025.60
$41.87$11,053.68
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