TE Connectivity (TE) AMPMODU 2mm Board-to-Board receptacles utilize phosphor bronze contacts with dual cantilever beams that are available in available in three gold plating options. The dual-beam design provides for an increased contact surface between the header pin and the receptacle contact to allow reliable signal transfer. Housed in a high-temperature-resistant liquid crystal polymer (LCP) plastic, receptacles can be applied in automated surface-mount, through-hole-reflow (Pin-inPaste) and traditional through-hole mount processes. The complete portfolio includes various top- and dual-entry vertical and horizontal receptacles that offer multiple options for Board-to-Board stacking of header and receptacle combinations.
TE Connectivity AMPMODU 2mm Board-to-Board Receptacles
Features
- Occupies 38% less space on PCB board compared with 2.54mm [0.1"] centerline, allowing for extended functionality
- Two-point electrical stability for reliable header and receptacle interconnection
- Multiple options for Board-to-Board stacking by headers and receptacles combination
- Ease of assembly with automated surface-mount and through-hole-reflow manufacturing
Applications
- PLC
- Servo Drives
- Industrial Controls
- Material Handling
- Instrumentation and Test Equipment
- Building Automation