The MC-LGA (Metal Contact Land Grid Array) socket technology is a stamped and formed metal contact developed for the high end server microprocessor and ASIC interconnections. The MC-LGA contact has been designed to provide both a large working range and interface wipe for a reliable, long term electrical connection from the microprocessor to the printed circuit board.
TE Connectivity MC LGA Sockets
Features
- Large contact working range (0.36 mm minimum)
- Large functional range (0.31 mm – 0.10 mm min deflection required to achieve 20 grams force)
- Wiping contact interface (0.10 min wipe with opposing loads to net zero lateral force on ASICand PCB)
- Contact tip geometries optimized:
- ASIC/CPU interface (hertz dot)
- PCB interface (spans PCB via hole)
- Scalable manufacturing process enables rapid socket size changes with minimal tooling investment (up to 7000+ positions at 1mm contact spacing)
Applications
- High end servers