The TE Connectivity MULTIGIG RT Connector product line is a backplane interconnect family that offers flexibility and customization. This printed circuit based, pinless interconnect family is comprised of modular components which can be used in a variety of combinations. The connectors in this innovatively flexible platform can be combined to provide the density, data throughput, and signal integrity required for a variety of today’s applications. The use of printed circuit wafers in this connector system allows for cost effective sequencing and electrical customization of the connector. Wafers can be manufactured specifically for differential or single ended performance and the impedance, propagation delay, and crosstalk of the connector can be altered per customer requirements. This scalable board to backplane connector family is a robust, “pinless” design which eliminates the pin field on backplane boards and reduces the end user’s exposure to field failure in card cage systems. The MULTIGIG RT connector family is designed specifically for 20.30 (.800) or 25.40 (1.00) card pitch.
- MULTIGIG RT 1
- 141 signals/inch, data rates up to 3.125 Gb/s
- 141 signals/inch, data rates up to 3.125 Gb/s
- MULTIGIG RT 2
- 113 signals/inch, data rates of 3.125 Gb/s to 6.4+ Gb/s and has been demonstrated to support 10 Gb/s
Complete connector family includes:
- Power modules
- maximize Amps/inch density, voltage in pairs
- maximize Amps/inch density, voltage in pairs
- Guidance modules
- Die cast for strength
- Three sequence levels Press fit or hardware mounted
- Backplane drill pattern enabled keying
- Die cast for strength
- Cable assembly proposals available