MP - Board to Board & Mezzanine Connectors
434 ResultsPart | Availability | Purchasing | RoHS/Lead | Product | Number of Positions | Pitch | Number of Rows | Termination Style | Mounting Angle | Stack Height | Current Rating | Voltage Rating | Maximum Data Rate | Minimum Operating Temperature | Maximum Operating Temperature | Contact Plating | Contact Material | Housing Material | Series | Packaging |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 40 Position | 0.635 mm (0.025 in) | 2 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 100 Position | 0.635 mm (0.025 in) | 5 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 60 Position | 0.635 mm (0.025 in) | 2 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 120 Position | 0.635 mm (0.025 in) | 4 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 150 Position | 0.635 mm (0.025 in) | 5 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 100 Position | 0.635 mm (0.025 in) | 5 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 150 Position | 0.635 mm (0.025 in) | 5 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket | 0In Stock | Connectors | 80 Position | 0.635 mm (0.025 in) | 4 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDF6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket | 0In Stock | Connectors | 150 Position | 0.635 mm (0.025 in) | 5 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDF6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 80 Position | 0.635 mm (0.025 in) | 4 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket | 0In Stock | Connectors | 90 Position | 0.635 mm (0.025 in) | 3 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDF6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket | 0In Stock | Connectors | 60 Position | 0.635 mm (0.025 in) | 3 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDF6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket | 0In Stock | Connectors | 100 Position | 0.635 mm (0.025 in) | 5 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDF6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket | 0In Stock | Connectors | 60 Position | 0.635 mm (0.025 in) | 2 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDF6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket | 0In Stock | Connectors | 120 Position | 0.635 mm (0.025 in) | 4 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDF6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 40 Position | 0.635 mm (0.025 in) | 2 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 60 Position | 0.635 mm (0.025 in) | 3 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 60 Position | 0.635 mm (0.025 in) | 2 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 90 Position | 0.635 mm (0.025 in) | 3 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 120 Position | 0.635 mm (0.025 in) | 4 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 60 Position | 0.635 mm (0.025 in) | 3 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 80 Position | 0.635 mm (0.025 in) | 4 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Terminal | 0In Stock | Connectors | 90 Position | 0.635 mm (0.025 in) | 3 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDM6 | ||||
TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors 0.635 mm AcceleRate mP High-Density, High-Speed Power/Signal Socket | 0In Stock | Connectors | 40 Position | 0.635 mm (0.025 in) | 2 Row | Solder | Vertical | 15 A | 200 VAC, 283 VDC | 64 Gb/s | - 55 C | + 125 C | Gold | Copper | Liquid Crystal Polymer (LCP) | UDF6 | ||||
Mfr: MPAT-120-D-G-13B TTI: Not Assigned Samtec Availability: 0In StockBoard to Board & Mezzanine Connectors | 0In Stock | MPAT |
