Weekly Global Update for October 2, 2013

IPC TMRC Agenda

Wednesday 9/25/2013

KEYNOTE: Economic, Political and Other Key Trends: 10 Things Happening Today that Will Affect Your Business Tomorrow - Gene Marks, New York Times Columnist

Business Outlook: Global Electronics Industry - Walter D. Custer, President, Custer Consulting Group

China Update: Current Competitiveness and Future Outlook for the PCB Industry in China - Hayao Nakahara, President, N.T. Information Ltd.

Automotive Technology Developments - Henry Sanftleben, Technology Fellow, Delphi Electronics and Safety

Thinking Small: Building a Business out of Nanotechnology - Patrick Murray, Ph.D., Vice President of R&D, Nanophase Technologies

How New Materials are Changing the Electronics Business - Phil Plonski, Managing Director, Prismark Partners

The Impact of Graphene: What is Next After the Hype? - Tomás Palacios, Ph.D., Associate Professor, Massachusetts Institute of Technology

Major Impacts: Highlights from the 2013 IPC Technology Roadmap - Marc Carter, Director of Technology Transfer, IPC

How Will We Get There? Suppliers Respond to Technology Trends

• Wet Chemistry - George Milad, National Accounts Manager for Technology, Uyemura International Corp.
• Laminate - Doug Trobough, Corporate Director of Applications Engineering, Isola SARL
• Imaging/Metallization/Plating - Jim Watkowski, Product Director for Metallization, MacDermid, Inc.

Networking Reception

Thursday, 9/26/2013

KEYNOTE: Global Economic Forecast - Robert Fry, Ph.D., Senior Economist, DuPont

Trends in 3D Packaging: The New Module Technology Emerges - Jan Vardaman, President, TechSearch International

High Performance, High Reliability Military Market Challenges - Dr. Wayne Johnson, Professor and Chair, Electrical and Computer Engineering Department, Tennessee Tech University

Advancing Trust in the Electronics Industry - James Libous, SME-PWB/CCA Technology Development, Lockheed Martin Missile & Fire Control