Last week Dr. Hayao Nakahara and I were the keynote speakers at the EIPC (European PCB Trade Organization) winter conference in Berlin, Germany. The event was very well attended

EIPC Winter Conference Program, Berlin, Germany

Day 1, Thursday January 31

Welcome by EIPC Chairman Alun Morgan, EIPC, UK

Keynote Session

Changing World of the World PCB Industry
Dr. Hayao Nakahara, N.T. Information Ltd., USA

Business outlook: Global electronics industry
Walt Custer, Custer Consulting Group, USA

Session 1: New Substrates and Surface Finishes

Newest ultra flat profile ED-Copper Foils for Low Loss and High Speed PCBs
Raymond Gales, Circuit Foil Luxembourg, LU

Capacitive Input Systems based on Glass - New trends driven by Hygiene and Design
Christian Borgert, FELA GmbH, DE

Alternate Soldering Finish offering Improvements in RF performance and PCB shelf life
Tim Gee, Stevenage Circuits Ltd., UK

PallaBond - Direct Palladium with Direct Gold on Copper - a revolutionary Surface Finish
Mustafa Oezkoek, Atotech Deutschland GmbH, DE

Networking Lunch Hotel Restaurant

Atotech Deutschland GmbH – facilities visit

Networking dinner: Restaurant Classic Remise Berlin

Day 2, Friday February 1

Session 2: Reliability and Testing

Black Pad Failure Mechanism of Electroless Ni-P / Immersion Au Coatings (ASPIS) Rimantas Ramanauskas, LIOC, LI Resistance increase of a pth during thermal cycling as sign of crack propagation Dr. Klaus Ritz, Industry Specialist, DE IST for assessing the reliability of electroless copper - Practical Experiences Yvonne Welz, Atotech Deutschland GmbH, DE Accelerated mechanical testing as an alternative method for qualification of electronic devices Golta Khatibi, University of Vienna, AT

Session 3: Novel Plating and Pattering Processes Insoluble
titanium anode technology for sustainable copper plating in PCB manufacturing Jacko Pijper, Magneto special anodes B.V., NL Using Megasonic Agitation to Fabricate High Aspect Ratio PCB blind Micro-vias Dennis Price, Merlin Circuit Technology Ltd., UK Maskless Electrochemical Surface Modification Process – The Enface Way Prof. Sudipta Roy, Royenface Ltd., UK Multi-wavelength Direct Imaging Technology Karel Tavernier, Ucamco NV, BE Advantages of LSO Technology™ over DMD Technology Uwe Altmann, Orbotech S.A., BE Networking Lunch Hotel restaurant

Session 4: Advanced Technologies - Pushing the Boundaries
Requirements of PCBs in Solar and LED applications Les Round, Spirit Circuits Ltd., UK Development of Embedded High Power Electronics Modules Lars Boettcher, Fraunhofer IZM, DE Embedded RFID Technology Jeni Spillane, Graphic Plc, UK Environmental Assessment of Printed Circuit Board Production to Support Design Decisions and Facilitate Carbon Footprinting of Electronics Products Karsten Schischke, Fraunhofer IZM, DE

Walt D. Custer


Walt Custer

Walt Custer is an industry analyst focused on the global electronics industry. Prior to forming Custer Consulting Group he was Vice President of Marketing and Sales for Morton Electronic Materials, a global supplier of specialty chemicals and process equipment for the PCB industry.

Custer has been a member of the IPC trade organization since 1975 where he received both the President's and the Raymond E. Pritchard Hall of Fame Awards. He is currently a member of the IPC Executive Market & Technology Steering Committee. Custer is also a Director of the EIPC European PCB trade organization.

He authors regular “Market Outlook” columns for Global SMT & Packaging magazine, the Journal of the HKPCA and the TTI MarketEYE website.

View other posts from Walt D. Custer. View other posts from Walt D. Custer.
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