FCI Introduces XCede® Backplane Connector Products

Singapore, 27 May 2011

FCI, a leading manufacturer of connectors and interconnect systems, announces the release of XCede® vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. The vertical header range also includes options with two-wall, three-wall, or four-wall connector shrouds. Among the three-wall options are versions with integrated guide posts and polarization key openings.

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